	State College Facility
	RF Products, Engineering Development
	Microwave Integrated Circuit Facilities
	Electromagnetic Modeling of Materials and Structures
	Modern CAE Environment for Microwave Design
	Thermal Modeling and Analysis
	Simulated and Measured Data of a Microstrip Coupled Line Filter
	Electronic Packaging and Mechanical Design
	Highly Integrated Microwave Receiver Model R-300A
	Multichannel Bi-phase Microwave Modulator
	Highly Integrated Microwave Repeater Module
	Wideband Converter
	Narrowband MMIC Converter
	Millimeter Wave Amplifier
	Specific Emitter Identification (SEI)
	High Dynamic Range HF Multicouplers
	High Dynamic Range Feedforward Amplifiers
	HF Beamformer
	Custom RF Amplifiers
	HF Signal Generator
	Micro-LORES - Radar Environment Simulator
	Modularized Components
	Antenna Feed & Reflector Development
	Collapsible 1-ft Dish Antenna
	Engineering Software, Assembly, and Test Capabilities

Engineering Software, Assembly, and Test Capabilities

CAD Software
	RF/Microwave Design:	Agilent Advanced Design System (ADS), Eagleware Genesys and Spectrasys, Custom Spur and Cascade Analysis
	Electro-Magnetic Simulation:	Sonnet EM
	Circuit Simulation:	Spectrum MicroCap
	System Analysis:	MatLAB, MathCAD
	Graphical Programming:	HP VEE, LabView
	Schematic Capture:	Cadence OrCAD Capture
	Board Layout:	AutoCAD, Protel, PowerPCB
	Digital Simulation:	ModelSim
	FPGA Design:	Xilinx Foundation/ISE
	CPLD Design:	Lattice Design Expert
	Mechanical Packaging:	AutoCAD (both 2d and 3d)
	Thermal Modeling:	Harvard Thermal TAS

Product Documentation
	In-house documentation adapted from DOD-D-1000 and DOD-STD-100, Level 2 Standard

Board Processing Capability
	FR4 (G-10) and Polyimide, with or without plated thru holes
	Multi-layer boards, up to 20 layers with 4 mid-layer power planes
	Softboard, Duroid, 5 mil to 62 mil
	Hardboard, Alumina, Aluminum Nitride, 10, 15, 25, and 30 mil
	Low Temperature Co-fired Ceramic (LTCC)
	In-house printed circuit board milling machine for Softboard and FR4

Test Equipment
	Wide array of digital/analog scopes, logic analyzers
	10 Hz to 40 GHz RF/Microwave Testing, spectrum analyzers, vector and scalar network analyzers, signal generators, frequency counters, waveguide and coaxial interfacing
	Temperature chamber, temperature controlled hot/cold thermal plate
	Calibration system certified to MIL-STD-45662A, ISO/IEC 17025-1999, and ANSI/NCSL Z540-1-1994

Prototype Assembly
	Board/Chassis/Rack fabrication and assembly
	RF and control cable assembly, including semi-rigid
	In-house model shop
	In-house printed circuit board milling machine
	MIC Hybrid Assembly: eutectic brazing and die attachment, thermal compression and thermalsonic bonding, plasma etching, parallel gap welding, bond pull testing. Class 10,000 clean rooms. MIC products designed to meet requirements of both MIL-STD-883C and MIL-E-5400.
	In-house quality workmanship and training program adapted from MIL-STD-454, J-STD-001, IPC-A-610C, and IPC-7711
	In-house ESD control system modeled on DOD-STD-1686

Logic Device Programming System
	Data I/O Unisite